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    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240249882A1

    公开(公告)日：2024-07-25

    申请号：US18387139

    申请日：2023-11-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Yun JEONG ,  Dong Jun JUNG ,  Hyun Sik CHAE ,  Ji Eun PARK ,  Sim Chung KANG ,  Dae Jin SHIM ,  Eun Jung LEE

    IPC: H01G4/12 ,  H01G4/012 ,  H01G4/30

    CPC classification number: H01G4/1227 ,  H01G4/012 ,  H01G4/30

    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes, and including first and second surfaces, third and fourth surfaces, fifth and sixth surfaces, external electrodes disposed on the third and fourth surfaces, and side margin portions disposed on the fifth and sixth surfaces. The side margin portions include a first region adjacent to the internal electrodes and a second region adjacent to outside of the side margin portions. In a Raman spectra obtained by analyzing one point located in the first and second region respectively, peak X appears in a Raman shift of 450 cm−1 to 600 cm−1. When a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the first region is λ(cm−1), a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the second region is λ+0.75 cm−1 or greater.

    MULTILAYER ELECTRONIC COMPONENT
    6.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20250166922A1

    公开(公告)日：2025-05-22

    申请号：US18795951

    申请日：2024-08-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyo Sung CHOI ,  Jung Jin PARK ,  Ho Sam CHOI ,  Dae Jin SHIM ,  Seung Yong LEE ,  Yong Hwa LEE ,  Jong Ho LEE

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

    Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction; and an external electrode disposed on the body. The cover portion may include barium (Ba), gallium (Ga), and tin (Sn), and a ratio (A/B) of the number of moles (A) of gallium (Ga) to 100 moles of barium (Ba) included in the cover portion to the number of moles (B) of tin (Sn) compared to 100 moles of barium (Ba) included in the cover portion may satisfy 0.2≤A/B≤4.0.

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