HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE
Abstract:
Disclosed is a heat-dissipating structure comprising: a case including: a first body and a second body spaced apart from each other; a wick disposed in a space between the first body and the second body, the wick including a plurality of wires arranged in a first direction and in a second direction intersecting the first direction, and having a working fluid passage formed along at least one opening formed between the plurality of wires; and a channel formed between the first body and the wick and in which the working fluid is moved through the at least one opening according to a change in state of the working fluid.
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