Invention Publication
- Patent Title: HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE
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Application No.: US18099522Application Date: 2023-01-20
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Publication No.: US20230156965A1Publication Date: 2023-05-18
- Inventor: Haein CHUNG , Kyungha KOO , Dongku KANG , Kangsik KIM , Wonmin KIM , Jihong KIM , Chihwan JEONG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20200090629 2020.07.21
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H04M1/02

Abstract:
Disclosed is a heat-dissipating structure comprising: a case including: a first body and a second body spaced apart from each other; a wick disposed in a space between the first body and the second body, the wick including a plurality of wires arranged in a first direction and in a second direction intersecting the first direction, and having a working fluid passage formed along at least one opening formed between the plurality of wires; and a channel formed between the first body and the wick and in which the working fluid is moved through the at least one opening according to a change in state of the working fluid.
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