公开(公告)号：US20230039881A1

公开(公告)日：2023-02-09

申请号：US17975169

申请日：2022-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haein CHUNG ,  Kyungha KOO ,  Kangsik KIM ,  Wonmin KIM

IPC: H05K7/20 ,  F16F15/04 ,  H04M1/02

Abstract: An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.

公开(公告)号：US20230156965A1

公开(公告)日：2023-05-18

申请号：US18099522

申请日：2023-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haein CHUNG ,  Kyungha KOO ,  Dongku KANG ,  Kangsik KIM ,  Wonmin KIM ,  Jihong KIM ,  Chihwan JEONG

IPC: H05K7/20 ,  H04M1/02

CPC classification number: H05K7/20336 ,  H04M1/0283

Abstract: Disclosed is a heat-dissipating structure comprising: a case including: a first body and a second body spaced apart from each other; a wick disposed in a space between the first body and the second body, the wick including a plurality of wires arranged in a first direction and in a second direction intersecting the first direction, and having a working fluid passage formed along at least one opening formed between the plurality of wires; and a channel formed between the first body and the wick and in which the working fluid is moved through the at least one opening according to a change in state of the working fluid.