A substrate processing apparatus includes a spraying unit installed in an inner space of a chamber member in which a substrate is processed, spraying a cleaning liquid into the inner space of the chamber member so as to clean devices for discharging a chemical liquid to the substrate and then collecting the chemical liquid, and spraying a drying gas for drying the remaining cleaning liquid into the inner space of the chamber member, a management unit removing a residue remaining on the spraying unit after the spraying unit sprays the cleaning liquid, and a controller controlling the spraying unit and the management unit.