Invention Publication
- Patent Title: DIE ALIGNMENT METHOD USING MAGNETIC FORCE
-
Application No.: US18075814Application Date: 2022-12-06
-
Publication No.: US20230178280A1Publication Date: 2023-06-08
- Inventor: Sumin KIM , Minwoo Rhee , Yongchul Shin , Ilyoung Han , Nungpyo Hong , Seungdon Lee , Kyeongbin Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-SI
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-SI
- Priority: KR 20210174778 2021.12.08
- Main IPC: H01F13/00
- IPC: H01F13/00 ; H01L25/00 ; H01L23/00

Abstract:
A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force between the first magnetic patterns and the second magnetic patterns. Each of the first magnetic patterns and the second magnetic patterns comprises a horizontally magnetically anisotropic material. The first magnetic patterns and the second magnetic patterns do not vertically overlap each other when the first die and the second die are vertically aligned with each other.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F13/00 | 磁化或去磁的设备或方法 |