公开(公告)号：US11581202B2

公开(公告)日：2023-02-14

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Chulhyun Park ,  Minjae Shin ,  Geunsik Oh ,  Hyunjin Lee ,  Soonwon Lee ,  Nungpyo Hong

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

公开(公告)号：US10923452B2

公开(公告)日：2021-02-16

申请号：US16783342

申请日：2020-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Taeyeong Kim ,  Jihoon Kang ,  Nohsung Kwak ,  Seokho Kim ,  Hoechul Kim ,  Ilhyoung Lee ,  Hakjun Lee

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.

公开(公告)号：US11942344B2

公开(公告)日：2024-03-26

申请号：US17224564

申请日：2021-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Mingi Hong ,  Choongbo Shim ,  Heejin Kim ,  Nungpyo Hong

IPC: H01L21/67 ,  G01J5/00 ,  G01K13/00

CPC classification number: H01L21/67248 ,  G01J5/00 ,  G01K13/00 ,  H01L21/67103

Abstract: In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.

公开(公告)号：US11651990B2

公开(公告)日：2023-05-16

申请号：US16712413

申请日：2019-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung Han ,  Hunyong Park ,  Sohee Han ,  Nohsung Kwak

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

公开(公告)号：US11430679B2

公开(公告)日：2022-08-30

申请号：US16821415

申请日：2020-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangnam Kim ,  Nohsung Kwak ,  Sungyeon Kim ,  Hyungjun Kim ,  Haejoong Park ,  Jongwoo Sun ,  Sangrok Oh ,  Ilyoung Han ,  Jungpyo Hong

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.

公开(公告)号：US20240186282A1

公开(公告)日：2024-06-06

申请号：US18239454

申请日：2023-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Kim ,  Minwoo Rhee ,  Ilyoung Han ,  Sujie Kang ,  Juno Kim ,  Daeho Min ,  Kyeongbin Lim

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75252 ,  H01L2224/75735 ,  H01L2224/75745 ,  H01L2224/75804 ,  H01L2224/75841 ,  H01L2924/2064

Abstract: A die bonding apparatus comprising a stage configured to support a first die, a pickup head configured to pick up a second die, regions of magnetic materials arranged on the first die and the second die, an electromagnet arranged on a surface of the pickup head or the stage; and a controller configured to apply a current to the electromagnet to generate a magnetic field when the first die and the second die are disposed at a predetermined distance from each other in a vertical direction. As a result of the magnetic field generated by the electromagnet, the regions of magnetic material arranged on first die and the second die are aligned with one another in the vertical direction.

公开(公告)号：US20240170445A1

公开(公告)日：2024-05-23

申请号：US18379956

申请日：2023-10-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juno Kim ,  Minwoo Rhee ,  Ilyoung Han ,  Juhyung Lee ,  Kyeongbin Lim

IPC: H01L23/00 ,  H01L21/66

CPC classification number: H01L24/80 ,  H01L22/12 ,  H01L2224/80224 ,  H01L2224/8023 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: Provided is a method of manufacturing a semiconductor package, the method including: providing a first semiconductor die on a stage; bonding a second semiconductor die to the first semiconductor die to each other; applying heat to a surface of the second semiconductor die, which is opposite to a bonding interface of the first semiconductor die and the second semiconductor die; and measuring a temperature change on the surface of the second semiconductor die to which the heat is applied to inspect a state of the bonding interface.

公开(公告)号：US11462410B2

公开(公告)日：2022-10-04

申请号：US16845959

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nohsung Kwak ,  Euijin Seo ,  Jonghwi Seo ,  Jaehee Lee ,  Ilyoung Han ,  Guesuk Lee

IPC: H01L21/20 ,  H01L21/268 ,  B23K26/066 ,  B23K26/352

Abstract: A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

公开(公告)号：US12224262B2

公开(公告)日：2025-02-11

申请号：US18638947

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyeong Kim ,  Ilyoung Han ,  Hoechul Kim

IPC: H01L23/00

Abstract: A substrate bonding method and apparatus are described. The substrate bonding apparatus is used to bond a first substrate to a second substrate. The bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.

公开(公告)号：US11990444B2

公开(公告)日：2024-05-21

申请号：US16933055

申请日：2020-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyeong Kim ,  Ilyoung Han ,  Hoechul Kim

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/16 ,  H01L24/80 ,  H01L2224/08145 ,  H01L2224/80091 ,  H01L2224/80095 ,  H01L2224/8012 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: A substrate bonding method and apparatus are described. The substrate bonding apparatus is used to bond a first substrate to a second substrate. The bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.