公开(公告)号：US20230178280A1

公开(公告)日：2023-06-08

申请号：US18075814

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sumin KIM ,  Minwoo Rhee ,  Yongchul Shin ,  Ilyoung Han ,  Nungpyo Hong ,  Seungdon Lee ,  Kyeongbin Lim

IPC: H01F13/00 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01F13/00 ,  H01L25/50 ,  H01L23/564

Abstract: A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force between the first magnetic patterns and the second magnetic patterns. Each of the first magnetic patterns and the second magnetic patterns comprises a horizontally magnetically anisotropic material. The first magnetic patterns and the second magnetic patterns do not vertically overlap each other when the first die and the second die are vertically aligned with each other.