Invention Publication
- Patent Title: CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME
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Application No.: US18062830Application Date: 2022-12-07
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Publication No.: US20230178394A1Publication Date: 2023-06-08
- Inventor: Tatsuya ISHIMOTO , Naoyuki TAKADA , Takahiro TOKUMIYA , Masato KAJINAMI
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: JP 21199182 2021.12.08 KR 20220130919 2022.10.12
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.
Information query
IPC分类:
