Abstract:
A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.
Abstract:
A photoelectric sensor retainer and a photoelectric pulse wave measuring apparatus including the same are provided. The photoelectric sensor retainer includes a sensor mounting unit on which a photoelectric sensor having a light-receiving surface is attachable and detachable, the light-receiving surface facing a measuring direction. The photoelectric sensor retainer further includes a pressing unit configured to press an upper surface of the sensor mounting unit in the measuring direction to apply pressure to the sensor mounting unit, and a pedestal including a seating plate configured to support the pressing unit, the seating plate having a principal plane perpendicular to a pressing direction of the pressing unit.
Abstract:
An electrostatic chuck module operates at temperatures above the heat resistance temperature of a resin. The electrostatic chuck module includes: a base that includes a flow path for a coolant disposed below the base, a concave part disposed on the base, and a convex part disposed along an outer circumference of the base; an insulator disposed in the concave part of the base; a resistance heating element disposed on or within the insulator; a crack plate disposed on the insulator and the resistance heating element; and a ceramics plate disposed on the crack plate and that includes an electrode that adsorbs a target object with static electricity. The convex part of the base is bonded to the crack plate.
Abstract:
An apparatus for manufacturing a semiconductor device may include a vacuum chamber, an electrostatic chuck (ESC), a cooler, an RF plate, a casing, a base plate and a gas supplier. The ESC may be arranged in the vacuum chamber. The cooler may be configured to cool the ESC. The RF plate may be arranged under the cooler. The casing may be configured to support the cooler. The base plate may be opposite to the RF plate to form an inner space together with the casing. The gas supplier may supply a gas having a low dew point to the inner space. Thus, a generation of the dew condensation at the very low temperature may be prevented so that a damage caused by a short, which may be generated by the dew condensation, may also be prevented.
Abstract:
A semiconductor manufacturing apparatus comprises an adsorption unit defining a plurality of pressing holes in the adsorption unit, the plurality of pressing holes configured to eject gas, and defining a plurality of suction holes in the adsorption unit, the plurality of suction holes configured to suction the gas and to handle a semiconductor chip through the gas. At least one of the suction holes is adjacent to at least one of an apex of the adsorption unit or an edge of the adsorption unit.
Abstract:
A method and an apparatus for acquiring biological information, and a wrist watch-type terminal using the same, are provided. The apparatus includes a first detector configured to irradiate a living body with a first light of a first wavelength, and detect a second light that is reflected from the living body, and a second detector configured to irradiate the living body with a third light of a second wavelength, and detect a fourth light that is reflected from the living body. The apparatus further includes a processor configured to determine a pulse wave of the living body based on a subtraction value of subtracting a detection signal that is determined by irradiating the third light of the second wavelength from a detection signal that is determined by irradiating the first light of the first wavelength.