Invention Publication
- Patent Title: SUBSTRATE TREATING APPARATUS AND METHOD THEREOF
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Application No.: US18081647Application Date: 2022-12-14
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Publication No.: US20230191780A1Publication Date: 2023-06-22
- Inventor: Hong Joo LEE , Moo Hyung YI
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Priority: KR 20210181647 2021.12.17
- Main IPC: B41J2/125
- IPC: B41J2/125 ; B41J2/14 ; B41J3/407

Abstract:
The present disclosure provides substrate processing apparatus and a substrate processing method for composing nozzles having different drop sizes into one or more pack units and performing pixel printing by using nozzles belonging to the thus composed packs. The substrate processing method includes extracting nozzles that have different drop sizes as different sized dropping nozzles, composing extracted nozzles into one or more packs, and performing pixel printing on the substrate with nozzles included in the pack by discharging a substrate treatment solution to a common target location on the substrate.
Information query
IPC分类: