公开(公告)号：US20230191780A1

公开(公告)日：2023-06-22

申请号：US18081647

申请日：2022-12-14

Applicant: SEMES CO., LTD.

Inventor： Hong Joo LEE ,  Moo Hyung YI

IPC: B41J2/125 ,  B41J2/14 ,  B41J3/407

CPC classification number: B41J2/125 ,  B41J2/14 ,  B41J3/407 ,  B41J2002/14475 ,  B41J2203/01

Abstract: The present disclosure provides substrate processing apparatus and a substrate processing method for composing nozzles having different drop sizes into one or more pack units and performing pixel printing by using nozzles belonging to the thus composed packs. The substrate processing method includes extracting nozzles that have different drop sizes as different sized dropping nozzles, composing extracted nozzles into one or more packs, and performing pixel printing on the substrate with nozzles included in the pack by discharging a substrate treatment solution to a common target location on the substrate.