- 专利标题: METHOD FOR MOLDING AND FORMING FLIP-FLOP AND MOLD THEREOF
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申请号: US18175297申请日: 2023-02-27
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公开(公告)号: US20230202130A1公开(公告)日: 2023-06-29
- 发明人: Ching-Hao CHEN , Liang-Hui YEH
- 申请人: OTRAJET INC.
- 申请人地址: TW Taichung City
- 专利权人: OTRAJET INC.
- 当前专利权人: OTRAJET INC.
- 当前专利权人地址: TW Taichung City
- 分案原申请号: US17546749 2021.12.09
- 主分类号: B29D35/02
- IPC分类号: B29D35/02 ; B29C44/58
摘要:
A main technical feature of a method for molding and forming a flip-flop and a mold thereof provided by the invention is that when a polymer raw material is filled into a mold chamber space of the mold, the filled raw material is preferentially flowed in a direction of a strap area space used to mold a V-shaped strap portion of the flip-flop to ensure that the slender V-shaped strap portion of the flip-flop can be integrally formed.
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