Invention Publication
- Patent Title: METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING CARBONYL COMPOUNDS
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Application No.: US18147733Application Date: 2022-12-29
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Publication No.: US20230215723A1Publication Date: 2023-07-06
- Inventor: EUNHYEA KO , Hoon Han , Soyoung Lee , Thanh Cuong Nguyen , Hiroyuki Uchiuzou , Kiyoshi Murata , Tomoharu Yoshino , Daekeon Kim , Younjoung Cho , Jiyu Choi , Byungkeun Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: KR 20210194552 2021.12.31 KR 20220152841 2022.11.15
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/455 ; C23C2/02 ; H01L21/311
Abstract:
To manufacture an integrated circuit (IC) device, a structure in which a first material film including silicon atoms and nitrogen atoms and a second material film devoid of nitrogen atoms is formed on a substrate. A carbonyl compound having a functional group without an α-hydrogen is applied to the structure, and thus, an inhibitor is selectively formed only on an exposed surface of the first material film from among the first material film and the second material film.
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