- 专利标题: CARRIER PLATE AND METHOD OF USE THEREOF
-
申请号: US18074298申请日: 2022-12-02
-
公开(公告)号: US20230226762A1公开(公告)日: 2023-07-20
- 发明人: Morteza VATANI , Seyed Mohammad SAJADI , Timothy BYMAN , Tom HAYS , Peter BRUSS , Don AMBLI , Justin CARROLL , Lawrence NGUYEN
- 申请人: Sakuu Corporation
- 申请人地址: US CA San Jose
- 专利权人: Sakuu Corporation
- 当前专利权人: Sakuu Corporation
- 当前专利权人地址: US CA San Jose
- 主分类号: B29C64/245
- IPC分类号: B29C64/245 ; B65G17/12 ; B33Y30/00
摘要:
Improved carrier plates and methods of use thereof are provided to secure and transport individual layers of a multilayer structure during manufacture of the multilayer structure. In one implementation a carrier plate is provided including a lower portion and a raised portion to support a flexible substrate holding an individual layer laid on an upper surface of the raised portion. Clamping mechanisms, such as rollers, are formed on extended regions adjacent to side walls of the raised portion. The clamping mechanisms are configured to move from open positions, where the clamping mechanisms are spaced apart from the sidewalls of the raised portion, to closed positions, where the clamping mechanisms secure opposite edge portions of the flexible substrate between the clamping mechanisms and the first and sidewalls of the raised portion.
信息查询