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1.
公开(公告)号:US20230226766A1
公开(公告)日:2023-07-20
申请号:US18074173
申请日:2022-12-02
申请人: Sakuu Corporation
发明人: Morteza VATANI , Timothy BYMAN , Justin CARROLL
IPC分类号: B29C64/35 , B29C64/209 , B29C64/214
CPC分类号: B29C64/35 , B29C64/209 , B29C64/214 , B33Y40/00
摘要: An improved apparatus and method are provided to remove powder from a web, for example, in a 3D printing apparatus. A flexible blade is provided to contact and move across a first portion of the web located between adjacent portions of the web to scrape powder from the first portion without removing powder deposited on the adjacent portions. A pair of edge vacuum nozzles and a central vacuum nozzle are also provided to move with the flexible blade to remove powder from both edges of the first portion and a central region of the first portion.
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公开(公告)号:US20230226764A1
公开(公告)日:2023-07-20
申请号:US18074236
申请日:2022-12-02
申请人: Sakuu Corporation
发明人: Morteza VATANI , Seyed Mohammad SAJADI , David Paul WANAMAKER , Kevin NESDAHL , Tim DEBRUIN , Brian LINDAHL , Justin CARROLL
IPC分类号: B29C64/314 , B29C64/141 , B29C64/218 , B33Y10/00 , B33Y30/00 , B33Y40/10 , B33Y50/02 , B29C64/393
CPC分类号: B29C64/314 , B29C64/141 , B29C64/218 , B33Y10/00 , B33Y30/00 , B33Y40/10 , B33Y50/02 , B29C64/393
摘要: An improved apparatus and method provide conditioning to a powder deposited on a substrate (e.g., a web), for example, by wetting the powder in a 3D printing apparatus. To achieve this in an exemplary implementation, a wetting apparatus is located between a powder dispenser and at least one top calendering roller in a direction of movement of the substrate, wherein the wetting apparatus is configured to apply a wetting agent to the powder on the substrate before the powder passes through the calendering roller. The wetting agent is comprised of a material which increases cohesiveness of the powder to prevent the powder from adhering to the top roller. In a particular implementation, the wetting agent is steam confined to an area of the substrate where the powder passes through the wetting apparatus, without wetting other areas of the substrate which are not in the wetting apparatus.
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3.
公开(公告)号:US20240351286A1
公开(公告)日:2024-10-24
申请号:US18656405
申请日:2024-05-06
申请人: Sakuu Corporation
发明人: Morteza VATANI , Timothy BYMAN , Justin CARROLL
IPC分类号: B29C64/35 , B08B5/04 , B22F12/67 , B29C64/153 , B29C64/209 , B29C64/214 , B33Y30/00 , B33Y40/00
CPC分类号: B29C64/35 , B29C64/209 , B29C64/214 , B08B5/04 , B22F12/67 , B29C64/153 , B33Y30/00 , B33Y40/00
摘要: An improved apparatus and method are provided to remove powder from a web, for example, in a 3D printing apparatus. A flexible blade is provided to contact and move across a first portion of the web located between adjacent portions of the web to scrape powder from the first portion without removing powder deposited on the adjacent portions. A pair of edge vacuum nozzles and a central vacuum nozzle are also provided to move with the flexible blade to remove powder from both edges of the first portion and a central region of the first portion.
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公开(公告)号:US20230226762A1
公开(公告)日:2023-07-20
申请号:US18074298
申请日:2022-12-02
申请人: Sakuu Corporation
发明人: Morteza VATANI , Seyed Mohammad SAJADI , Timothy BYMAN , Tom HAYS , Peter BRUSS , Don AMBLI , Justin CARROLL , Lawrence NGUYEN
IPC分类号: B29C64/245 , B65G17/12 , B33Y30/00
CPC分类号: B29C64/245 , B65G17/12 , B33Y30/00
摘要: Improved carrier plates and methods of use thereof are provided to secure and transport individual layers of a multilayer structure during manufacture of the multilayer structure. In one implementation a carrier plate is provided including a lower portion and a raised portion to support a flexible substrate holding an individual layer laid on an upper surface of the raised portion. Clamping mechanisms, such as rollers, are formed on extended regions adjacent to side walls of the raised portion. The clamping mechanisms are configured to move from open positions, where the clamping mechanisms are spaced apart from the sidewalls of the raised portion, to closed positions, where the clamping mechanisms secure opposite edge portions of the flexible substrate between the clamping mechanisms and the first and sidewalls of the raised portion.
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