公开(公告)号：US20230226762A1

公开(公告)日：2023-07-20

申请号：US18074298

申请日：2022-12-02

申请人： Sakuu Corporation

发明人： Morteza VATANI ,  Seyed Mohammad SAJADI ,  Timothy BYMAN ,  Tom HAYS ,  Peter BRUSS ,  Don AMBLI ,  Justin CARROLL ,  Lawrence NGUYEN

IPC分类号： B29C64/245 ,  B65G17/12 ,  B33Y30/00

CPC分类号： B29C64/245 ,  B65G17/12 ,  B33Y30/00

摘要： Improved carrier plates and methods of use thereof are provided to secure and transport individual layers of a multilayer structure during manufacture of the multilayer structure. In one implementation a carrier plate is provided including a lower portion and a raised portion to support a flexible substrate holding an individual layer laid on an upper surface of the raised portion. Clamping mechanisms, such as rollers, are formed on extended regions adjacent to side walls of the raised portion. The clamping mechanisms are configured to move from open positions, where the clamping mechanisms are spaced apart from the sidewalls of the raised portion, to closed positions, where the clamping mechanisms secure opposite edge portions of the flexible substrate between the clamping mechanisms and the first and sidewalls of the raised portion.