Invention Publication
- Patent Title: FORMING THREE-DIMENSIONAL (3D) PRINTED ELECTRONICS
-
Application No.: US18132821Application Date: 2023-04-10
-
Publication No.: US20230264414A1Publication Date: 2023-08-24
- Inventor: Kristopher J. ERICKSON , Thomas ANTHONY , Howard S. TOM , Sivapackia GANAPATHIAPPAN , Lihua ZHAO , Krzysztof NAUKA
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- The original application number of the division: US15763200 2018.03.26
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y50/02 ; B33Y10/00 ; B33Y70/00 ; B33Y80/00 ; B29C67/00 ; C09B47/06 ; C09B47/24 ; C09B47/067 ; B33Y40/00 ; B29C64/40 ; B29C64/00 ; B29C64/176 ; B29C64/10 ; B29C64/182 ; B33Y99/00 ; B29C64/25 ; B33Y40/10 ; B33Y50/00 ; B29C64/205 ; B29C64/307 ; B29C64/245 ; B33Y40/20 ; B29C64/255 ; B29C64/30 ; B29C64/227 ; B22F10/28 ; B22F10/50 ; B33Y30/00 ; B29C64/20 ; B29C64/393
Abstract:
In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.
Information query
