公开(公告)号：US20240001446A1

公开(公告)日：2024-01-04

申请号：US18037920

申请日：2020-12-01

申请人： Hewlett-Packard Development Company, L.P.

发明人： John Samuel Dilip JANGAM ,  Thomas ANTHONY ,  Lihua ZHAO ,  James MCKINNELL

IPC分类号： B22F10/62 ,  B33Y70/10 ,  B22F1/05 ,  B22F1/103 ,  B33Y10/00 ,  B22F10/14 ,  B22F10/64 ,  B33Y40/20

CPC分类号： B22F10/62 ,  B33Y70/10 ,  B22F1/05 ,  B22F1/103 ,  B33Y10/00 ,  B22F10/14 ,  B22F10/64 ,  B33Y40/20 ,  B22F2301/052 ,  B22F2301/35 ,  B22F2301/205 ,  B22F2302/253 ,  B22F2998/10 ,  B22F2999/00 ,  B22F2201/11 ,  B22F2201/013

摘要： A shaping composition for controlling deformation of a green body object can include from about 10 wt % to about 80 wt % liquid vehicle, and from about 10 wt % to about 90 wt % metal particulates. The metal particulates can include from about 35 wt % to about 90 wt % high melting point metal particles, from about 10 wt % to about 65 wt % aluminum alloy particles, and from about 0.1 wt % to about 10 wt % metal complex selected from an inorganic metal salt, an organic metal salt, or a metal oxide. The metal of the metal complex can include copper, iron, aluminum, chromium, titanium, cobalt, silver, gold, nickel, tin, or zinc.

公开(公告)号：US20230264414A1

公开(公告)日：2023-08-24

申请号：US18132821

申请日：2023-04-10

申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人： Kristopher J. ERICKSON ,  Thomas ANTHONY ,  Howard S. TOM ,  Sivapackia GANAPATHIAPPAN ,  Lihua ZHAO ,  Krzysztof NAUKA

IPC分类号： B29C64/165 ,  B33Y50/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  B29C67/00 ,  C09B47/06 ,  C09B47/24 ,  C09B47/067 ,  B33Y40/00 ,  B29C64/40 ,  B29C64/00 ,  B29C64/176 ,  B29C64/10 ,  B29C64/182 ,  B33Y99/00 ,  B29C64/25 ,  B33Y40/10 ,  B33Y50/00 ,  B29C64/205 ,  B29C64/307 ,  B29C64/245 ,  B33Y40/20 ,  B29C64/255 ,  B29C64/30 ,  B29C64/227 ,  B22F10/28 ,  B22F10/50 ,  B33Y30/00 ,  B29C64/20 ,  B29C64/393

CPC分类号： B29C64/165 ,  B22F10/28 ,  B22F10/50 ,  B29C64/00 ,  B29C64/10 ,  B29C64/176 ,  B29C64/182 ,  B29C64/20 ,  B29C64/205 ,  B29C64/227 ,  B29C64/245 ,  B29C64/25 ,  B29C64/255 ,  B29C64/30 ,  B29C64/307 ,  B29C64/393 ,  B29C64/40 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  C09B47/065 ,  C09B47/0678 ,  C09B47/24 ,  B22F2999/00 ,  G03G2215/2054 ,  G05B2219/49023 ,  G05B2219/49246 ,  Y10T156/1722 ,  Y10T156/1798

摘要： In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

公开(公告)号：US20210178466A1

公开(公告)日：2021-06-17

申请号：US16077183

申请日：2017-07-19

申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人： Thomas ANTHONY ,  Kristopher ERICKSON ,  Howard S. TOM

IPC分类号： B22F1/00 ,  B22F3/10 ,  B22F10/10

摘要： Methods of forming 3D printed metal objects and compositions for 3D printing are described herein. In an example, a method of forming a 3D printed metal object can comprise: (A): a build material comprising at least one metal being deposited; (B): a fusing agent being selectively jetted on the build material, the fusing agent comprising: (i) at least one hydrated metal salt having a dehydration temperature of from about 100° C. to about 250° C., and (ii) a carrier liquid comprising at least one surfactant and water; (C): the build material and the selectively jetted fusing agent being heated to a temperature of from about 100° C. to about 250° C. to: (a) remove the carrier liquid, (b) dehydrate the hydrated metal salt, and (c) bind the build material and the selectively jetted fusing agent; and (D): (A), (B), and (C) being repeated at least one time to form the 3D printed metal object.