- 专利标题： HERMETIC SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR SIDE EMITTING LASER AND METHOD FORMING SAME
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申请号： US17965195申请日： 2022-10-13
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公开(公告)号： US20230031489A1公开(公告)日： 2023-02-02
- 发明人: JinHan Ju , Gabriel Charlebois
- 申请人： Excelitas Canada, Inc.
- 申请人地址： CA Vaudreuil-Dorion
- 专利权人： Excelitas Canada, Inc.
- 当前专利权人： Excelitas Canada, Inc.
- 当前专利权人地址： CA Vaudreuil-Dorion
- 主分类号： H01S5/02208
- IPC分类号： H01S5/02208 ; H01S5/02315 ; H01S5/02218 ; H01S5/02345 ; H01S5/02257 ; H01S5/40
摘要：
A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.
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