公开(公告)号：US20240297478A1

公开(公告)日：2024-09-05

申请号：US18415663

申请日：2024-01-18

申请人： Qisda Corporation

发明人： Wen-Chung Ho ,  Tsung-Hsun Wu ,  Cheng-Hsun Wu

IPC分类号： H01S5/02255 ,  H01S5/02218

CPC分类号： H01S5/02255 ,  H01S5/02218

摘要： An optical engine module including a plastic housing, a first light source, and a light path turning unit is disclosed. The plastic housing has a first light incident side and a light emerging side. The light emerging side is adjacent to the light incident side. The first light source is disposed on the first light incident side, and configured to emit a first beam. The light path turning unit is disposed in the plastic housing, and configured to turn and transmit the first beam to the light emerging side. A material of the light path turning unit includes metal.

公开(公告)号：US12044956B2

公开(公告)日：2024-07-23

申请号：US17268288

申请日：2019-07-26

申请人： Sony Corporation

发明人： Hisayoshi Motobayashi ,  Hidekazu Kawanishi ,  Yoshiro Takiguchi ,  Masahiro Murayama ,  Hiroyuki Miyahara ,  Hitoshi Domon

IPC分类号： G03B21/20 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/323 ,  H01S5/40

CPC分类号： G03B21/2033 ,  G03B21/208 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4031 ,  H01S5/4087

摘要： A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.

公开(公告)号：US11728618B2

公开(公告)日：2023-08-15

申请号：US17456827

申请日：2021-11-29

申请人： Cisco Technology, Inc.

发明人： Frederick W. Warning, Jr.

IPC分类号： H01S5/024 ,  H01S5/40 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/02218 ,  H01S5/02253

CPC分类号： H01S5/02469 ,  H01S5/02218 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/4025 ,  H01S5/02253

摘要： An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.

公开(公告)号：US20220115837A1

公开(公告)日：2022-04-14

申请号：US17492758

申请日：2021-10-04

申请人： LITE-ON TECHNOLOGY CORPORATION

发明人： Hsin-Wei Tsai ,  Shu-Hua Yang

IPC分类号： H01S5/02257 ,  H01S5/02218 ,  H01S5/00

摘要： An electronic device is provided. The electronic device includes a substrate, a semiconductor unit, a wall, and a light-transmitting member. The semiconductor unit is mounted on the substrate. The wall is disposed on the substrate and surrounds the semiconductor unit. The wall includes two exterior wall components and two interior wall components. The two exterior wall components are spaced apart from each other, so that two gaps are formed between the two exterior wall components. The two gaps are in spatial communication with an installation area that is surrounded by the two exterior wall components. The two interior wall components are arranged in the installation area and spaced apart from each other. The two interior wall components correspond in position to the two gaps and respectively shade parts of the two gaps. The light-transmitting member is disposed on the wall and covered on the semiconductor unit.

公开(公告)号：US12040587B2

公开(公告)日：2024-07-16

申请号：US17265283

申请日：2019-12-17

申请人： SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.

发明人： Mitsuyoshi Miyata

IPC分类号： H01S3/04 ,  H01S5/02208 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/02345 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/06 ,  H01S5/0687 ,  H01S5/00

CPC分类号： H01S5/02208 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/02345 ,  H01S5/0239 ,  H01S5/02415 ,  H01S5/0612 ,  H01S5/0687 ,  H01S5/0014

摘要： An optical semiconductor device includes a chassis that has an external wall, a feedthrough that penetrates the external wall of the chassis and has a projection portion projecting toward outside of the chassis from the external wall, a connection terminal that is electrically connected to a component mounted in the chassis and is on the projection portion of the feedthrough, a first temperature detector that is on an external face of the external wall of the chassis and detects a temperature of the chassis, and a flexible substrate of which an end is connected to the connection terminal and of which a portion spaced from the end is connected to the first temperature detector, wherein the first temperature detector is between the external wall and the flexible substrate.

公开(公告)号：US20230198221A1

公开(公告)日：2023-06-22

申请号：US18172120

申请日：2023-02-21

申请人： Nuvoton Technology Corporation Japan

发明人： Kazuhiko YAMANAKA

IPC分类号： H01S5/02257 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/024

CPC分类号： H01S5/02257 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/02461 ,  H01S5/02469

摘要： A semiconductor light-emitting device is provided which includes: a wiring substrate; a semiconductor light-emitting element disposed above an upper surface of the wiring substrate; and a cap unit which covers the semiconductor light-emitting element. The wiring substrate includes: a first substrate; a first metal layer and a second metal layer that are spaced apart from each other above the first substrate; and a spacer layer disposed above the first substrate. The cap unit includes a bonding surface which is bonded to the wiring substrate. The bonding surface intersects the first metal layer and the second metal layer in a top view of the wiring substrate, and the spacer layer is disposed between the bonding surface and the first substrate, at a position different from positions of the first metal layer and the second metal layer.

公开(公告)号：US20220368100A1

公开(公告)日：2022-11-17

申请号：US17712932

申请日：2022-04-04

申请人： STMicroelectronics PTE LTD

发明人： Loic Pierre Louis RENARD

IPC分类号： H01S5/026 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0239 ,  G02F1/01 ,  H01S5/183

摘要： An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

公开(公告)号：US20220365295A1

公开(公告)日：2022-11-17

申请号：US17731868

申请日：2022-04-28

申请人： Hangzhou Guangzhiyuan Technology Co., Ltd.

发明人： Samuel Jiang ,  Yichen Shen

IPC分类号： G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  G02B6/293 ,  H01S5/0234 ,  H01S5/02218

摘要： The present disclosure provides a three-dimensional packaging method and a three-dimensional package structure of a photonic-electronic chip. The method includes: fixing an electronic chip on a first area of a first surface of a photonic chip; fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a cavity with a single-sided opening, and the opening of the cavity faces and covers an optical coupling interface.

公开(公告)号：US20220294179A1

公开(公告)日：2022-09-15

申请号：US17636421

申请日：2020-07-20

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Kiyohisa SAKAI ,  Hirohisa YASUKAWA ,  Nobuaki KAJI

IPC分类号： H01S5/0225 ,  H01S5/042 ,  H01S5/0233 ,  H01S5/02218 ,  H01S5/00 ,  H01S5/024

摘要： An object of the present technique is to improve safety in a semiconductor laser driving apparatus that diffuses laser light by a diffusion plate. A substrate incorporates a laser driver, and a semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A diffusion plate diffuses laser light irradiated by the semiconductor laser. A transparent conductive film is formed on a predetermined surface of the diffusion plate. In addition, the laser driver drives the semiconductor laser to irradiate the laser light on the basis of an electric characteristic value of the conductive film.

公开(公告)号：US20240178633A1

公开(公告)日：2024-05-30

申请号：US18505528

申请日：2023-11-09

申请人： EOL CO., LTD

发明人： Su Hyun Kim ,  Dai Hyoung Koo ,  Gi Hwan Myeong

IPC分类号： H01S5/024 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/40

CPC分类号： H01S5/02423 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/4012 ,  H01S5/4075

摘要： A laser diode package according to the present disclosure includes a packaging housing unit and a coolant housing unit, wherein the coolant housing unit is coupled to the packaging housing unit, includes a coolant inlet through which coolant is introduced and a coolant outlet through which the coolant is discharged, and has a coolant flow path therein, and laser light source units disposed on a base of the packaging housing unit and each including a laser diode configured to emit a laser beam, wherein the laser light source unit includes a cooler coupled to the base, including a coolant channel connected to the coolant flow path of the coolant housing unit, and having at least an upper surface made of a metal layer, and a submount bonding-coupled to the upper surface of the cooler and having an upper surface to which the laser diode is bonding-coupled.