Invention Publication
- Patent Title: SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
-
Application No.: US17743848Application Date: 2022-05-13
-
Publication No.: US20230367730A1Publication Date: 2023-11-16
- Inventor: YULEI SHEN , TYRONE TUNG HUANG , CHEN-KUAN HONG
- Applicant: ADVANCED MICRO DEVICES, INC. , ATI TECHNOLOGIES ULC
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.,ATI TECHNOLOGIES ULC
- Current Assignee: ADVANCED MICRO DEVICES, INC.,ATI TECHNOLOGIES ULC
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/20 ; H01L25/065 ; H01L23/538
Abstract:
A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
Public/Granted literature
- US11886370B2 Sharing package pins in a multi-chip module (MCM) Public/Granted day:2024-01-30
Information query
