公开(公告)号：US20230367730A1

公开(公告)日：2023-11-16

申请号：US17743848

申请日：2022-05-13

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： YULEI SHEN ,  TYRONE TUNG HUANG ,  CHEN-KUAN HONG

IPC: G06F13/40 ,  G06F13/20 ,  H01L25/065 ,  H01L23/538

CPC classification number: G06F13/4031 ,  G06F13/20 ,  H01L23/5382 ,  H01L25/0655 ,  H01L24/16 ,  H01L2924/1431

Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.

公开(公告)号：US20240126712A1

公开(公告)日：2024-04-18

申请号：US18392072

申请日：2023-12-21

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： YULEI SHEN ,  TYRONE TUNG HUANG ,  CHEN-KUAN HONG

IPC: G06F13/40 ,  G06F13/20 ,  H01L23/538 ,  H01L25/065

CPC classification number: G06F13/4031 ,  G06F13/20 ,  H01L23/5382 ,  H01L25/0655 ,  H01L23/5386 ,  H01L24/16

Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.