Invention Publication
- Patent Title: CRITICAL DIMENSION UNIFORMITY
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Application No.: US18360445Application Date: 2023-07-27
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Publication No.: US20230367943A1Publication Date: 2023-11-16
- Inventor: Chi-Ta Lu , Chi-Ming Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- The original application number of the division: US17358407 2021.06.25
- Main IPC: G06F30/39
- IPC: G06F30/39

Abstract:
A method includes receiving a pattern layout for a mask, shrinking the pattern layout to form a shrunk pattern, determining centerlines for each of a plurality of features within the shrunk pattern, and snapping the centerline for each of the plurality of features to a grid. The grid represents a minimum resolution size of a mask fabrication tool. The method further includes, after snapping the centerline for each of the plurality of features to the grid, fabricating the mask with the shrunk pattern.
Public/Granted literature
- US12254258B2 Critical dimension uniformity Public/Granted day:2025-03-18
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