发明公开
- 专利标题： SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS DISPOSED
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申请号： US17829601申请日： 2022-06-01
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公开(公告)号： US20230395558A1公开(公告)日： 2023-12-07
- 发明人: Wu-Der YANG
- 申请人： NANYA TECHNOLOGY CORPORATION
- 申请人地址： TW New Taipei City
- 专利权人： NANYA TECHNOLOGY CORPORATION
- 当前专利权人： NANYA TECHNOLOGY CORPORATION
- 当前专利权人地址： TW New Taipei City
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A semiconductor device includes a substrate; an electronic component disposed on the substrate; a bonding wire comprising a first terminal connected to the electronic component and a second terminal connected to the substrate; and a supporter disposed between the first terminal and the second terminal of the bonding wire.
信息查询
IPC分类:
