发明公开
- 专利标题: SEMICONDUCTOR DEVICE
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申请号: US18196191申请日: 2023-05-11
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公开(公告)号: US20230402458A1公开(公告)日: 2023-12-14
- 发明人: Jinyeong Joe , Hyohoon Byeon , Namhyun Lee , Sungkeun Lim , Yuyeong Jo
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20220071545 2022.06.13
- 主分类号: H01L27/092
- IPC分类号: H01L27/092 ; H01L29/06 ; H01L29/10 ; H01L29/423 ; H01L29/417 ; H01L29/775 ; H01L21/822 ; H01L21/8238 ; H01L29/66
摘要:
A semiconductor device includes a first transistor structure on a substrate, the first transistor structure including first channel layers spaced apart from each other, a first gate electrode surrounding the first channel layers, a first source/drain region connected to the first channel layers on a first side of the first gate electrode, and a second source/drain region connected to the first channel layers on a second side of the first gate electrode that is opposite to the first side of the first gate electrode, and a second transistor structure on the first transistor structure, the second transistor structure including second channel layers spaced apart from each other, a second gate electrode surrounding the second channel layers, and a third source/drain region connected to the second channel layers on a first side of the second gate electrode.
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