Embodiments herein relate to systems, apparatuses, or processes directed to an organic adhesion promoter layer on the surface of a copper trace to reduce delamination between a dielectric material and the surface of the copper trace, and to facilitate a smooth surface interface between the surface of the copper trace and of a copper feature, such as a copper-filled via, placed on the surface of the copper trace. The smooth surface interface reduces insertion loss and enables routing of higher frequency signals on a package, and does not require roughing of the copper trace in order to adhere to the dielectric material. Other embodiments may be described and/or claimed.