Invention Application
- Patent Title: COMPOSITIONS AND METHODS OF USE THEREOF
-
Application No.: US17875458Application Date: 2022-07-28
-
Publication No.: US20230052829A1Publication Date: 2023-02-16
- Inventor: Ting-Kai Huang , Bin Hu , Yannan Liang , Hong Piao
- Applicant: Fujifilm Electronic Materials U.S.A., Inc.
- Applicant Address: US RI N. Kingstown
- Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee Address: US RI N. Kingstown
- Main IPC: C09G1/04
- IPC: C09G1/04 ; H01L21/321
Abstract:
This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.
Information query
