专利检索 ap:("Fujifilm Electronic Materials U.S.A., Inc.") AND inv:"Hong Piao" 第 1 页

1.

发明申请
COMPOSITIONS AND METHODS OF USE THEREOF 有权

公开(公告)号：US20230052829A1

公开(公告)日：2023-02-16

申请号：US17875458

申请日：2022-07-28

申请人： Fujifilm Electronic Materials U.S.A., Inc.

发明人： Ting-Kai Huang , Bin Hu , Yannan Liang , Hong Piao

IPC分类号： C09G1/04 , H01L21/321

摘要： This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.

2.

发明公开
COMPOSITIONS AND METHODS OF USE THEREOF 审中-公开

公开(公告)号：US20240141205A1

公开(公告)日：2024-05-02

申请号：US18408986

申请日：2024-01-10

申请人： Fujifilm Electronic Materials U.S.A, Inc

发明人： Ting-Kai Huang , Bin Hu , Yannan Liang , Hong Piao

IPC分类号： C09G1/04 , H01L21/321

CPC分类号： C09G1/04 , H01L21/3212

摘要： This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.