Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
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Application No.: US17903302Application Date: 2022-09-06
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Publication No.: US20230072034A1Publication Date: 2023-03-09
- Inventor: Toshihiro IGUCHI , Yoshitaka NAGASHIMA , Yasuhiro OKUI , Masahide ISHIZUYA , Yuuki HIDAKA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2021-145969 20210908
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/012
Abstract:
A multilayer electronic component includes a plurality of dielectric layers and a plurality of electrode layers that are alternately stacked. A skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more.
Public/Granted literature
- US12014879B2 Multilayer electronic component Public/Granted day:2024-06-18
Information query
