公开(公告)号：US20220351905A1

公开(公告)日：2022-11-03

申请号：US17731471

申请日：2022-04-28

Applicant: TDK CORPORATION

Inventor： Masahide ISHIZUYA

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/248

Abstract: The electronic component includes an element body 4 having a plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d in a continuous manner along a circumference direction; and properties (a pore ratio, dielectric particle sizes, and so on) of the insulation layers 16a to 16d are substantially consistent along a circumference direction.

公开(公告)号：US20230072034A1

公开(公告)日：2023-03-09

申请号：US17903302

申请日：2022-09-06

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI ,  Yoshitaka NAGASHIMA ,  Yasuhiro OKUI ,  Masahide ISHIZUYA ,  Yuuki HIDAKA

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012

Abstract: A multilayer electronic component includes a plurality of dielectric layers and a plurality of electrode layers that are alternately stacked. A skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more.

公开(公告)号：US20220165502A1

公开(公告)日：2022-05-26

申请号：US17521305

申请日：2021-11-08

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI ,  Masahide ISHIZUYA ,  Takeshi SHIBAHARA

IPC: H01G4/30

Abstract: To provide a multilayer electronic component of which a reliability is not compromised and also a crack is suppressed from forming even when the multilayer electronic component is made thinner. A multilayer electronic component including an element body in which at least one dielectric layer and at least one internal electrode layer are stacked in an alternating manner, wherein a thickness variation of the at least one internal electrode layer is larger than a thickness variation of the at least one dielectric layer.

公开(公告)号：US20220351907A1

公开(公告)日：2022-11-03

申请号：US17724893

申请日：2022-04-20

Applicant: TDK CORPORATION

Inventor： Masahide ISHIZUYA

IPC: H01G4/224 ,  H01G4/30

Abstract: The electronic component includes an element body 4 having plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d along the circumference direction in a continuous manner, and melting points of the insulation layers 16a to 16d are lower than melting points of dielectric layers 10 and 11 included in the element body 4. The main component of the insulation layer is glass.