MULTILAYER ELECTRONIC DEVICE
    1.
    发明公开

    公开(公告)号:US20240177936A1

    公开(公告)日:2024-05-30

    申请号:US18498794

    申请日:2023-10-31

    CPC classification number: H01G4/30 H01G4/008 H01G4/012 H01G4/1227

    Abstract: A multilayer electronic device includes an element body including an interior region and an exterior region and a pair of external electrodes. The interior region includes inner dielectric layers and internal electrode layers laminated alternately. The exterior region is disposed outwards from the interior region in a lamination direction. The pair of external electrodes is disposed on a surface of the element body and connected to the internal electrode layers. DRAa DRBb>DRBc are satisfied, where “RA” includes an element having a highest mole ratio among “RE” in the inner dielectric layers of a third region at a center of the interior region in the lamination direction, “RB” includes an element having a highest mole ratio among “RE” in a first region at a center of the exterior region in the lamination direction, and “RA” and “RB” are different from each other.

    MULTILAYER ELECTRONIC DEVICE
    2.
    发明公开

    公开(公告)号:US20240047136A1

    公开(公告)日:2024-02-08

    申请号:US18357505

    申请日:2023-07-24

    CPC classification number: H01G4/1209 H01G4/30

    Abstract: A multilayer electronic device includes an element body and a pair of external electrodes. The element body includes an interior region in which inner dielectric layers and internal electrode layers are alternately laminated and an exterior region located outside the interior region in its lamination direction. The pair of external electrodes exists on surfaces of the element body. Main-phase particles in the inner dielectric layers and outer dielectric layers of the exterior region include a main component having a perovskite crystal structure represented by a general formula of ABO3. r1

    ELECTRONIC COMPONENT
    4.
    发明公开

    公开(公告)号:US20240112863A1

    公开(公告)日:2024-04-04

    申请号:US18468502

    申请日:2023-09-15

    CPC classification number: H01G4/012 H01G4/2325 H01G4/30

    Abstract: An electronic component includes: a first internal electrode provided in an element body; a second internal electrode provided in the element body; a third internal electrode provided in the element body and drawn out to a first side surface; and a fourth internal electrode provided in the element body and drawn out to a second side surface. The third internal electrode and the fourth internal electrode are electrically connected to each other through an external connection conductor formed on at least the first side surface and the second side surface. In a first direction, the first internal electrode faces the third internal electrode without facing the second internal electrode and the fourth internal electrode. In the first direction, the second internal electrode faces the fourth internal electrode without facing the first internal electrode and the third internal electrode.

    ELECTRONIC COMPONENT
    5.
    发明公开

    公开(公告)号:US20240112860A1

    公开(公告)日:2024-04-04

    申请号:US18465613

    申请日:2023-09-12

    CPC classification number: H01G4/005 H01G4/232 H01G4/30

    Abstract: An electronic component includes: a first internal electrode which is provided inside an element body and is drawn on a first main surface corresponding to a mounting surface; a second internal electrode which is provided inside the element body, is provided at a position different from the first internal electrode when viewed from a third direction, and is drawn on the first main surface; a third internal electrode which is provided inside the element body, is provided at a position facing the first internal electrode and the second internal electrode in the third direction, and is drawn on the first main surface; wherein the first internal electrode and the third internal electrode face each other in the third direction to form a first capacitor portion, and wherein the second internal electrode and the third internal electrode face each other in the third direction to form a second capacitor portion.

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