Invention Application
- Patent Title: WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT
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Application No.: US17942487Application Date: 2022-09-12
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Publication No.: US20230100613A1Publication Date: 2023-03-30
- Inventor: Franz-Josef Pichler , Johannes Mueller , Christoph Ahamer , Gerald Lackner , Walter Horst Leitgeb
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102021124738.1 20210924
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/268 ; H01L21/78
Abstract:
A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes an annular groove that overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The wafer support plate includes a ventilation channel configured to ventilate the annular groove.
Information query
IPC分类:
