公开(公告)号：US20230098233A1

公开(公告)日：2023-03-30

申请号：US17942441

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Leitgeb

IPC: H01L21/683

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.

公开(公告)号：US12205842B2

公开(公告)日：2025-01-21

申请号：US17942441

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Leitgeb

IPC: H01T23/00 ,  H01L21/683

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.

公开(公告)号：US20230100613A1

公开(公告)日：2023-03-30

申请号：US17942487

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Horst Leitgeb

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/268 ,  H01L21/78

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes an annular groove that overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The wafer support plate includes a ventilation channel configured to ventilate the annular groove.