公开(公告)号：US09873555B2

公开(公告)日：2018-01-23

申请号：US15459420

申请日：2017-03-15

Applicant: Infineon Technologies AG

Inventor： Franco Mariani ,  Christoph Ahamer ,  Corneleus Esguerra Caunan

IPC: H01L23/02 ,  B65D85/00 ,  B65D73/02 ,  H01L23/053 ,  H01L23/10

CPC classification number: B65D73/02 ,  H01L23/053 ,  H01L23/10 ,  H01L24/75 ,  H01L2224/75601 ,  H05K13/0084

Abstract: A carrier tape comprises a flexible body portion having a top surface. The flexible body portion comprises a plurality of pockets. Each of the plurality of pockets comprises pocket side walls, a base bottom portion fully circulating a raised bottom portion of a pedestal. The pedestal is made up of the raised bottom portion and pedestal side walls. The pedestal sidewalls, the base bottom portion and a lower part of the pocket side walls constitute a trench fully circulating the pedestal.

公开(公告)号：US12205842B2

公开(公告)日：2025-01-21

申请号：US17942441

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Leitgeb

IPC: H01T23/00 ,  H01L21/683

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.

公开(公告)号：US20230100613A1

公开(公告)日：2023-03-30

申请号：US17942487

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Horst Leitgeb

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/268 ,  H01L21/78

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes an annular groove that overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The wafer support plate includes a ventilation channel configured to ventilate the annular groove.

公开(公告)号：US20230098233A1

公开(公告)日：2023-03-30

申请号：US17942441

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Leitgeb

IPC: H01L21/683

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.

公开(公告)号：US20170283144A1

公开(公告)日：2017-10-05

申请号：US15459420

申请日：2017-03-15

Applicant: Infineon Technologies AG

Inventor： Franco Mariani ,  Christoph Ahamer ,  Corneleus Esguerra Caunan

IPC: B65D73/02 ,  H01L23/10 ,  H01L23/053

CPC classification number: B65D73/02 ,  H01L23/053 ,  H01L23/10 ,  H01L24/75 ,  H01L2224/75601 ,  H05K13/0084

Abstract: A carrier tape comprises a flexible body portion having a top surface. The flexible body portion comprises a plurality of pockets. Each of the plurality of pockets comprises pocket side walls, a base bottom portion fully circulating a raised bottom portion of a pedestal. The pedestal is made up of the raised bottom portion and pedestal side walls. The pedestal sidewalls, the base bottom portion and a lower part of the pocket side walls constitute a trench fully circulating the pedestal.