Invention Application
- Patent Title: SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS
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Application No.: US17851638Application Date: 2022-06-28
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Publication No.: US20230116153A1Publication Date: 2023-04-13
- Inventor: Lakshmikanth Krishnamurthy SHIRAHATTI , Kirankumar Neelasandra SAVANDAIAH , Prashant A. DESAI , Thomas BREZOCZKY
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.
Information query
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