公开(公告)号：US20230116153A1

公开(公告)日：2023-04-13

申请号：US17851638

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Prashant A. DESAI ,  Thomas BREZOCZKY

IPC: H01L21/67

Abstract: Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.

公开(公告)号：US20200291522A1

公开(公告)日：2020-09-17

申请号：US16802284

申请日：2020-02-26

Applicant: Applied Materials, Inc.

Inventor： Hanish Kumar PANAVALAPPIL KUMARANKUTTY ,  Prashant A. DESAI ,  Diwakar N. KEDLAYA ,  Sumit AGARWAL ,  Vidyadharan Srinivasa Murthy BANGALORE ,  Truong NGUYEN ,  Zubin HUANG

IPC: C23C16/455

Abstract: The present disclosure relates to a lid assembly apparatus and related methods for substrate processing chambers. In one implementation, a lid assembly includes a gas manifold. The gas manifold includes a first gas channel configured to receive a process gas, a second gas channel configured to receive a doping gas, and a third gas channel configured to receive a cleaning gas. The lid assembly also includes a showerhead. The showerhead includes one or more first gas openings that are configured to receive the process gas, and one or more second gas openings that are configured to receive the doping gas.