Invention Application
- Patent Title: MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US17504546Application Date: 2021-10-19
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Publication No.: US20230118367A1Publication Date: 2023-04-20
- Inventor: Wen-Chieh Tsai , Cheng-Ta Yang , Tsung-Wei Lin
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung City
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung City
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768

Abstract:
Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.
Public/Granted literature
- US11876048B2 Memory device and method of manufacturing the same Public/Granted day:2024-01-16
Information query
IPC分类: