Invention Application
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Application No.: US17528159Application Date: 2021-11-16
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Publication No.: US20230129579A1Publication Date: 2023-04-27
- Inventor: Hao-Ming Lee , Ta Kang Lo , Tsai-Fu Chen , Shou-Wei Hsieh
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Priority: CN202111245701.8 20211026
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/20 ; H01L29/66 ; H01L29/06 ; H01L29/40 ; H01L29/417 ; H01L29/423

Abstract:
A high electron mobility transistor (HEMT) device including a substrate, a channel layer, a barrier layer, a p-type gallium nitride (GaN) spacer, a gate electrode, a source electrode, and a drain electrode is provided. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer and has a protruding portion. The P-type GaN spacer is disposed on a side wall of the protruding portion. The gate electrode is disposed on the protruding portion and the P-type GaN spacer. The source electrode and the drain electrode are disposed on two sides of the gate electrode.
Public/Granted literature
- US12100756B2 High electron mobility transistor device having a barrier layer with a protruding portion Public/Granted day:2024-09-24
Information query
IPC分类: