Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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Application No.: US18090634Application Date: 2022-12-29
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Publication No.: US20230132598A1Publication Date: 2023-05-04
- Inventor: Shunpei YAMAZAKI , Shinya SASAGAWA , Erika TAKAHASHI , Katsuaki TOCHIBAYASHI , Ryo ARASAWA
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP ATSUGI-SHI
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP ATSUGI-SHI
- Priority: JP2018-087261 20180427
- Main IPC: H01L29/24
- IPC: H01L29/24 ; H10B12/00 ; H01L27/12

Abstract:
A semiconductor device in which variations in characteristics, deterioration of elements, and abnormality in shape are inhibited is provided. The semiconductor device includes a first region including a plurality of elements and a second region including a plurality of dummy elements. The second region is provided in an outer edge of the first region, and the element and the dummy element each include an oxide semiconductor. The element and the dummy element have the same structure, and a structure body included in the element and a structure body included in the dummy element are formed with the same material and provided in the same layer. The oxide semiconductor includes In, an element M (M is Al, Ga, Y, or Sn), and Zn.
Public/Granted literature
- US12057480B2 Semiconductor device Public/Granted day:2024-08-06
Information query
IPC分类: