Invention Application
- Patent Title: MASK LAYOUT CORRECTION METHODS BASED ON MACHINE LEARNING, AND MASK MANUFACTURING METHODS INCLUDING THE CORRECTION METHODS
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Application No.: US17841734Application Date: 2022-06-16
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Publication No.: US20230132893A1Publication Date: 2023-05-04
- Inventor: Mijin Kwon , Sangchul Yeo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0149955 20211103
- Main IPC: G03F1/36
- IPC: G03F1/36 ; G06T7/00 ; G03F1/70 ; G06F16/51

Abstract:
A reliable mask layout correction method capable of manufacturing a mask including a curvilinear pattern, and a mask manufacturing method including the correction method. The mask layout correction method based on machine learning may include: acquiring optical proximity correction (OPC)-ed layout images for masks including a curvilinear pattern, extracting mask contour images from scanning electron microscope (SEM) images for masks manufactured based on the OPC-ed layout images, performing machine learning using the OPC-ed layout images and the mask contour images to generate a conversion model, and correcting the OPC-ed layout images using the conversion model.
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