Invention Application
- Patent Title: RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
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Application No.: US17852853Application Date: 2022-06-29
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Publication No.: US20230135089A1Publication Date: 2023-05-04
- Inventor: Hansol YOO , Wonkeun KIM
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0149730 20211103
- Main IPC: H01L21/56
- IPC: H01L21/56 ; B32B7/06 ; B32B27/30 ; B32B5/02 ; B32B27/12 ; B29C33/68
Abstract:
A release film may include a conductive polymer substrate layer, and release layers provided on a top surface and a bottom surface of the conductive polymer substrate layer. Each of the release layers may include a fluorine-based polymer, and a density of the conductive polymer substrate layer ranges from 0.1 g/cm3 to 0.5 g/cm3.
Information query
IPC分类:
