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公开(公告)号：US20230135089A1
公开(公告)日：2023-05-04
申请号：US17852853
申请日：2022-06-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hansol YOO , Wonkeun KIM
Abstract: A release film may include a conductive polymer substrate layer, and release layers provided on a top surface and a bottom surface of the conductive polymer substrate layer. Each of the release layers may include a fluorine-based polymer, and a density of the conductive polymer substrate layer ranges from 0.1 g/cm3 to 0.5 g/cm3.
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