Invention Application
- Patent Title: POLISHING COMPOSITION
-
Application No.: US17914821Application Date: 2021-03-17
-
Publication No.: US20230136485A1Publication Date: 2023-05-04
- Inventor: Shinichiro TAKAMI
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Aichi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Aichi
- Priority: JP2020-060778 20200330
- International Application: PCT/JP2021/010795 WO 20210317
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; H01L21/02

Abstract:
Provided is a polishing composition that allows yielding a smooth surface comparable with or more than a surface produced by an abrasive-free polishing composition, and can be preferably used under both condition of low pressure and high pressure, in polishing of a hardness material. The polishing composition is a polishing composition for polishing a material having a Vickers hardness of 1500 Hv or more. The polishing composition contains particles and an oxidant, and the content of the particles is less than 400 ppm.
Information query