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1.发明公开公开(公告)号：US20240218208A1
公开(公告)日：2024-07-04
申请号：US18543206
申请日：2023-12-18
申请人： FUJIMI INCORPORATED
发明人： Ryota MAE , Shota SUZUKI
CPC分类号： C09G1/02 , C09K3/1436
摘要： An object of the present invention is to provide means that can polish both silicon nitride and silicon oxide at a high polishing removal rate.
The present invention provides a polishing composition including abrasive grains and an acidic compound. The abrasive grains are inorganic particles having an organic acid immobilized on a surface thereof. In a particle size distribution of the abrasive grains measured by a dynamic light scattering method, D90/D10 is 2.2 or more and D50 is 70 nm or more, where D10 is a particle diameter when a cumulative particle mass from a fine particle side reaches 10% of the total particle mass, D50 is a particle diameter when the cumulative particle mass from the fine particle side reaches 50% of the total particle mass, and D90 is a particle diameter when the cumulative particle mass from the fine particle side reaches 90% of the total particle mass.-
公开(公告)号：US20240117218A1
公开(公告)日：2024-04-11
申请号：US18275285
申请日：2022-02-02
申请人： FUJIMI INCORPORATED
发明人： Yuichiro NAKAGAI , Hiroyuki ODA , Yasuki ITO , Shogaku IDE , Shinichiro TAKAMI
IPC分类号： C09G1/02
CPC分类号： C09G1/02
摘要： Provided are a polishing method and a polishing composition that are applied to polishing of silicon carbide and allows reduction of rise in pH of the polishing composition and increase in pad temperature during polishing. Provided is a method of polishing an object to be polished having a surface formed of silicon carbide. The method includes steps of preparing a polishing composition, and supplying the polishing composition to the object to be polished and polishing the object to be polished. The polishing composition contains permanganate, a metal salt A, and water. The metal salt A is a salt of a metal cation having a pKa of less than 7.0 in form of a hydrated metal ion, and an anion.
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公开(公告)号：US20240110080A1
公开(公告)日：2024-04-04
申请号：US18529763
申请日：2023-12-05
申请人： FUJIMI INCORPORATED
发明人： Yuichiro NAKAGAI , Yasuaki ITO , Hiroyuki ODA , Shogaku IDE , Shinichiro TAKAMI
IPC分类号： C09G1/02
CPC分类号： C09G1/02
摘要： Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies at least one condition of the following conditions [A], [B], and [C]:
satisfying both of 500≤(C1/W1) and 0.04≤(C2/C1); [A]
satisfying both of 200≤(C1/√(W1)) and 8≤C2; and [B]
satisfying both of 500≤(C1/W1) and 8≤C2. [C]-
公开(公告)号：US20240101866A1
公开(公告)日：2024-03-28
申请号：US18370486
申请日：2023-09-20
申请人： FUJIMI INCORPORATED
发明人： Ryota Mae
IPC分类号： C09G1/02
CPC分类号： C09G1/02
摘要： A polishing composition capable of increasing a polishing selectivity ratio of SiOC to silicon nitride, a production method of the polishing composition, a polishing method, and a manufacturing method of a semiconductor substrate are provided.
The polishing composition contains abrasives having a zeta potential of −5 mV or less, a cationic surfactant, a phosphonic acid-based chelating agent, and a cationic compound having a molecular weight of 300 or less.-
公开(公告)号：US20240052203A1
公开(公告)日：2024-02-15
申请号：US18266750
申请日：2021-11-10
申请人： FUJIMI INCORPORATED
发明人： RYO WAKABAYASHI
IPC分类号： C09G1/02
CPC分类号： C09G1/02
摘要： The present invention is to provide a means for reducing surface roughness (Ra) while maintaining a high polishing rate in polishing of an object to be polished containing a resin and a filler. A polishing composition of the present invention comprises alumina particles, colloidal silica particles, and a dispersing medium for use in polishing an object to be polished containing a resin and a filler, in which the alumina particles have an average particle size of less than 2.8 μm, and the colloidal silica particles have an average particle size less than the average particle size of the alumina particles.
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公开(公告)号：US11884843B2
公开(公告)日：2024-01-30
申请号：US17901412
申请日：2022-09-01
申请人： FUJIMI INCORPORATED
发明人： Ryota Mae
IPC分类号： C09G1/02 , H01L21/3105 , B24B7/22 , C09K3/14
CPC分类号： C09G1/02 , B24B7/228 , C09K3/1409 , H01L21/31053
摘要： A polishing composition according to the present invention contains abrasive grains, a basic inorganic compound, an anionic water-soluble polymer, and a dispersing medium, in which a zeta potential of the abrasive grains is negative, an aspect ratio of the abrasive grains is 1.1 or less, in a particle size distribution of the abrasive grains obtained by a laser diffraction/scattering method, a ratio D90/D50 of a particle diameter D90 when an integrated particle mass reaches 90% of a total particle mass from a fine particle side to a particle diameter D50 when the integrated particle mass reaches 50% of the total particle mass from the fine particle side is more than 1.3, and the basic inorganic compound is an alkali metal salt.
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公开(公告)号：US11814294B2
公开(公告)日：2023-11-14
申请号：US17331728
申请日：2021-05-27
申请人： FUJIMI INCORPORATED
发明人： Ryota Mae
CPC分类号： C01B33/14 , C09K3/1409 , C09K3/1436
摘要： There is provided a method of producing anionically modified colloidal silica capable of polishing a silicon nitride film at a high speed and suppressing a polishing speed of a silicon oxide film. A method of producing anionically modified colloidal silica includes ion exchanging raw colloidal silica using an ion exchange resin (ion exchange step); and anionically modifying ion-exchanged raw colloidal silica to obtain anionically modified colloidal silica (modification step).
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公开(公告)号：US20230331930A1
公开(公告)日：2023-10-19
申请号：US18028920
申请日：2021-06-09
申请人： FUJIMI INCORPORATED
CPC分类号： C08J3/07 , C09G1/02 , C08J2329/04
摘要： To provide a polyvinyl alcohol composition effectively suppressed in generation of an aggregated product, in a method for producing a wetting agent for a semiconductor, containing a polyvinyl alcohol composition.
A method for producing a wetting agent for a semiconductor, containing a polyvinyl alcohol composition, wherein the polyvinyl alcohol composition is obtained through an addition-in-liquid step of adding into the inside of any one solution of a first liquid containing polyvinyl alcohol and water and a second liquid other than the first liquid, the other liquid of the first liquid and the second liquid.-
公开(公告)号：US20230321628A1
公开(公告)日：2023-10-12
申请号：US18019663
申请日：2021-08-05
申请人： FUJIMI INCORPORATED
发明人： Robert HEPBURN , Shogo TSUBOTA
CPC分类号： B01J20/08 , B01D15/00 , B01J20/28011 , B01J20/28061 , B01J20/28083 , C01F7/02 , C01P2006/12 , C01P2006/16 , C01P2006/32
摘要： Provided is an absorption method of an element belonging to periods 4 to 6 and groups 3 to 15 of the periodic table. The method includes: preparing mesoporous alumina that satisfies at least one of the following items:
(1) a surface hydroxyl content is 3.5 mmol/g or more;
(2) a low-temperature CO2 desorption amount in CO2 thermal desorption amount spectrometry is 5 µmol/g or more; and
(3) a low-temperature NH3 desorption amount in NH3 thermal desorption amount spectrometry is 25 µmol/g or more; and
bringing a liquid containing an absorption target element in contact with the mesoporous alumina to absorb the absorption target element in the mesoporous alumina. The absorption target element is at least one type selected from the group consisting of an element belonging to periods 4 to 6 and groups 3 to 15 of the periodic table.-
10.发明公开公开(公告)号：US20230313070A1
公开(公告)日：2023-10-05
申请号：US18122016
申请日：2023-03-15
申请人： FUJIMI INCORPORATED
发明人： TSUTOMU YOSHINO
IPC分类号： C11D1/83 , C11D11/00 , C09G1/02 , H01L21/3105 , H01L21/321
CPC分类号： C11D1/83 , C11D11/0047 , C09G1/02 , H01L21/31053 , H01L21/3212 , C11D1/76
摘要： Means capable of sufficiently removing residues remaining on a surface of a polished object containing silicon nitride and at least one selected from the group consisting of silicon oxide and polysilicon is provided. A composition for surface treatment, comprising: a nitrogen-free nonionic polymer, a nitrogen-containing nonionic polymer, and an anionic polymer, wherein the nitrogen-free nonionic polymer has a weight-average molecular weight of less than 100,000, the ratio of a weight-average molecular weight of the nitrogen-containing nonionic polymer to the weight-average molecular weight of the nitrogen-free nonionic polymer (nitrogen-containing nonionic polymer/nitrogen-free nonionic polymer) is 0.1 or more and 10 or less, and the composition for surface treatment has a pH of less than 7.0.
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