Invention Application
- Patent Title: INTERWAFER CONNECTION STRUCTURE FOR COUPLING WAFERS IN A WAFER STACK
-
Application No.: US17515354Application Date: 2021-10-29
-
Publication No.: US20230140675A1Publication Date: 2023-05-04
- Inventor: Myongseob KIM , Henley LIU , Cheang Whang CHANG
- Applicant: XILINX, INC.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/66 ; H01L23/00
Abstract:
An integrated circuit (IC) device is disclosed which includes at least a first hybrid bond interface layer disposed between adjacent wafers of a wafer stack. Routing within the hybrid bond interface layer allows test pads exposed on a top wafer of the wafer stack to electrically couple test keys within the wafer stack. By utilizing the routing within the hybrid bond interface layer to index electrical connections between adjacent wafers, IC dies stacked on the wafers may be fabricated with less mask sets as compared to conventional designs.
Public/Granted literature
- US11901338B2 Interwafer connection structure for coupling wafers in a wafer stack Public/Granted day:2024-02-13
Information query
IPC分类:
