- 专利标题： GRAPHICS PROCESSING INTEGRATED CIRCUIT PACKAGE
-
申请号： US18350902申请日： 2023-07-12
-
公开(公告)号： US20240004829A1公开(公告)日： 2024-01-04
- 发明人: Altug Koker , Farshad Akhbari , Feng Chen , Dukhwan Kim , Narayan Srinivasa , Nadathur Rajagopalan Satish , Liwei Ma , Jeremy Bottleson , Eriko Nurvitadhi , Joydeep Ray , Ping T. Tang , Michael S. Strickland , Xiaoming Chen , Tatiana Shpeisman , Abhishek R. Appu
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： G06F15/80
- IPC分类号： G06F15/80 ; G06F13/40 ; G06T1/20 ; G06F9/30 ; G06F13/00 ; G06N3/063 ; G06N3/084 ; G06N3/044 ; G06N3/045 ; G06N3/048
摘要：
An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.
信息查询
