Invention Publication
- Patent Title: INTEGRATED CIRCUIT STRUCTURES HAVING RAISED EPITAXY ON CHANNEL TRANSISTOR
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Application No.: US17855567Application Date: 2022-06-30
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Publication No.: US20240006483A1Publication Date: 2024-01-04
- Inventor: Abhishek Anil SHARMA , Tahir GHANI , Rishabh MEHANDRU , Anand S. MURTHY , Wilfred GOMES , Cory WEBER , Sagar SUTHRAM
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/786 ; H01L27/088 ; H01L29/417 ; H01L29/78

Abstract:
Structures having raised epitaxy on channel structure transistors are described. In an example, an integrated circuit structure includes a channel structure having multi-layer epitaxial source or drain structures thereon, the multi-layer epitaxial source or drain structures having a recess extending there through. A gate dielectric layer is on a bottom and along sides of the recess and laterally surrounded by the epitaxial source or drain structures. A gate electrode is on and laterally surrounded by the gate dielectric layer. The gate electrode has an uppermost surface below an uppermost surface of the gate dielectric layer.
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