Invention Publication
- Patent Title: STACKED FET SRAM
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Application No.: US17854780Application Date: 2022-06-30
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Publication No.: US20240008242A1Publication Date: 2024-01-04
- Inventor: Ruilong Xie , Carl Radens , Albert M. Chu , Brent A. Anderson , Junli Wang , Julien Frougier , Ravikumar Ramachandran
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Amonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Amonk
- Main IPC: H01L27/11
- IPC: H01L27/11

Abstract:
A semiconductor device is provided that includes at least one stacked FET device including two top transistors stacked over a single bottom transistor. The at least one stacked FET includes a full gate cut structure that is used to separate different device areas from each other, a top gate cut structure that used to separate the two top transistors, and a bottom gate cut structure that is used to provide the single bottom transistor. The at least one FET device can be used to provide a SRAM containing six transistors.
Information query
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