Invention Publication
- Patent Title: PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
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Application No.: US18217896Application Date: 2023-07-03
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Publication No.: US20240014005A1Publication Date: 2024-01-11
- Inventor: Hiroyuki MATSUURA , Nobuo MATSUKI , Taro IKEDA
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP 22109300 2022.07.06
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01J37/34

Abstract:
A plasma processing apparatus includes a processing container having an opening in a sidewall, a partition wall that covers the opening and forms an internal space communicating with an inside of the processing container, an internal electrode that passes through the partition wall, is detachably and airtightly inserted into the internal space, and is supplied with RF power, and an external electrode provided outside the partition wall.
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