Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME
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Application No.: US18217827Application Date: 2023-07-03
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Publication No.: US20240014083A1Publication Date: 2024-01-11
- Inventor: Hem P. Takiar , Raj K. Bansal , Jian Wei Lim , Li Wang , Jungbae Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L23/16
- IPC: H01L23/16 ; H01L23/00 ; H01L25/065 ; H01L21/48
Abstract:
A method of making a semiconductor device assembly is provided. The method comprises attaching a first semiconductor device to an upper surface of a substrate and disposing a stencil over the upper surface of the substrate. The stencil includes (i) an opening and (ii) a cavity in which the first semiconductor device is disposed. The method further comprises screen-printing an epoxy material into the opening and onto the upper surface of the substrate, removing the stencil, and planarizing an upper surface of the epoxy material to form an epoxy spacer.
Information query
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